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TSMC

TSMC reportedly to raise advanced packaging prices by up to 20 percent

TSMC is said to be preparing a 10 to 20 percent price increase for CoWoS packaging due to tight AI chip capacity. Analysts estimate monthly capacity will exceed 130,000 wafers in 2026 and reach 200,000 by 2027.

TSM+1.4%

Part of a series: TSMC: the latest, in order

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  1. TSM+1.4%TSMC$424.37

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AI and chips

Ftc seeks Anthropic testimony in AI safety probe

The FTC has requested testimony from Anthropic executives as part of a broader investigation into AI firms. The agency also issued subpoenas to Anthropic and OpenAI regarding safety, security, and privacy matters.

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