The Marked Chart Wire · Tech and AI
TSMC
TSMC reportedly to raise advanced packaging prices by up to 20 percent
TSMC is said to be preparing a 10 to 20 percent price increase for CoWoS packaging due to tight AI chip capacity. Analysts estimate monthly capacity will exceed 130,000 wafers in 2026 and reach 200,000 by 2027.
Part of a series: TSMC: the latest, in order
